MediaTek is set to unveil its next-generation Dimensity chip, expected to be the Dimensity 8400, on December 23, 2024. This chip aims to build on the success of its predecessor, the Dimensity 8300, and promises significant performance improvements. With advanced architecture, better power efficiency, and groundbreaking performance metrics, the Dimensity 8400 is poised to make a splash in the sub-flagship chipset market.

Launch Details
The highly anticipated launch event will take place on December 23, 2024, at 3:00 PM local time in China. MediaTek has already released teaser posters for the event, confirming that a new Dimensity chip will be the highlight. The timing aligns with MediaTek’s strategy of providing competitive alternatives to Qualcomm’s mid-tier and high-performance offerings.
Core Architecture and Manufacturing Process
The Dimensity 8400 is expected to retain the TSMC 4nm process, similar to the Dimensity 8300. However, it will introduce a new architecture that exclusively employs Cortex-A725 cores, replacing the older A5xx cores. The detailed core configuration is as follows:
Core Type | Clock Speed | Quantity |
---|---|---|
Cortex-A725 Performance Core | 3.25 GHz | 1 |
Cortex-A725 Performance Cores | 3.00 GHz | 3 |
Cortex-A725 Efficiency Cores | 2.10 GHz | 4 |
This configuration ensures an optimal balance between raw performance and energy efficiency, making it ideal for demanding applications and prolonged usage.
GPU and Graphics Performance
The chipset will integrate the ARM Immortalis G720 MC7 GPU, clocked at 1.3 GHz. This GPU promises improved graphical performance, enabling smooth gaming experiences and better rendering of high-resolution visuals. MediaTek’s emphasis on GPU enhancements ensures that the Dimensity 8400 can compete with Qualcomm’s Snapdragon 8 Gen 2 and Gen 3 processors in gaming and multimedia performance.
Benchmark Performance
The Dimensity 8400 has reportedly scored an impressive 1.8 million points on the AnTuTu benchmark, significantly surpassing the 1.52 million points achieved by the Dimensity 8300-powered Redmi K70E and the 1.48 million points of the POCO X6 Pro. This leap in performance places the Dimensity 8400 closer to Qualcomm’s high-end processors, ensuring a compelling option for manufacturers seeking premium performance in a sub-flagship price range.
Key Features and Improvements
The Dimensity 8400 introduces several key features that make it stand out:
- All Cortex-A725 Architecture: Offers improved processing power and efficiency compared to older designs.
- Enhanced GPU: The Immortalis G720 MC7 provides a smoother gaming experience and better graphics rendering.
- Advanced AI Capabilities: Optimized for AI-based tasks, such as voice recognition, image processing, and real-time translations.
- Improved Power Efficiency: The 4nm process ensures reduced power consumption, leading to better battery life in devices.
- 5G Connectivity: Supports advanced 5G features, ensuring faster and more stable connections.
Expected Smartphones with Dimensity 8400
Several smartphone brands are rumored to adopt the Dimensity 8400 for their upcoming models. Xiaomi is expected to debut the chipset in the Redmi Turbo 4, which will replace the Snapdragon 8s Gen 3 previously used in the Redmi Turbo 3. Other brands are also likely to announce devices featuring the Dimensity 8400 shortly after its official launch.
Competitive Positioning
MediaTek’s Dimensity 8400 aims to fill the gap between high-performance flagship processors and mid-range chips. It competes directly with Qualcomm’s Snapdragon 8 Gen 2 and Gen 3, offering comparable performance at a potentially lower cost. This makes it an attractive choice for manufacturers targeting premium mid-range and affordable flagship markets.
Detailed Specifications Table
Feature | Details |
Manufacturing Process | TSMC 4nm |
Core Architecture | All Cortex-A725 |
Primary Core | 1 x 3.25 GHz Cortex-A725 |
Performance Cores | 3 x 3.00 GHz Cortex-A725 |
Efficiency Cores | 4 x 2.10 GHz Cortex-A725 |
GPU | ARM Immortalis G720 MC7 (1.3 GHz) |
AI Features | Advanced AI processing |
Benchmark Score (AnTuTu) | 1.8 million+ |
5G Connectivity | Supported |
Target Devices | Sub-flagship smartphones |
Conclusion
The MediaTek Dimensity 8400 represents a significant step forward in the sub-flagship chipset segment. With its advanced architecture, improved GPU, and impressive benchmark scores, it promises to deliver top-tier performance at a competitive price point. Smartphone manufacturers and consumers alike have much to look forward to when this chip debuts on December 23, 2024. Following the launch, a wave of devices powered by the Dimensity 8400 is expected, further cementing MediaTek’s position as a leader in mobile chipset innovation.