MediaTek has unveiled its latest mid-range chipset, the MediaTek Dimensity 7350 SoC, designed to power mid-range smartphones. This new chipset is built on TSMC’s second-generation 4nm process and incorporates advanced features for enhanced performance, especially in gaming and AI tasks. Here are all the key details.
Key Features and Specifications
- Manufacturing Process: Built on TSMC’s 2nd generation 4nm process.
- CPU:
- 2x Arm Cortex-A715 cores clocked at up to 3.0GHz.
- 6x Arm Cortex-A510 cores for power efficiency.
- GPU: Arm Mali-G610 MC4 for robust graphics performance.
- AI: MediaTek NPU 657 to enhance AI-fusion processing and power efficiency.
- Memory and Storage:
- Supports LPDDR5 and LPDDR4x RAM up to 6400Mbps.
- UFS 3.1 storage for fast data access.
- Camera Support:
- Supports up to 200MP camera sensors.
- 14-bit HDR imaging with MediaTek Imagiq 765 ISP.
- Capable of 4K30 video recording.
- Features like EIS, dual simultaneous video capture, AI-2A (AI-AF, AI-AWB), and all-pixel AF.
- Display:
- Supports Full HD+ resolution.
- 144Hz refresh rate for smooth visuals.
- Connectivity:
- 2G-5G Multi-Mode support.
- 5G/4G carrier aggregation, 5G/4G FDD/TDD, and other cellular standards.
- Wi-Fi 6E (a/b/g/n/ac/ax).
- Bluetooth 5.3 for low-latency audio and reliable connections.
- GPS, BeiDou, GLONASS, Galileo, QZSS, and NavIC for global navigation.
- Gaming:
- MediaTek HyperEngine 5.0 for optimized gaming performance.
- Smart resource optimization for CPU and GPU.
- Low-latency wireless earbuds with Bluetooth LE Audio.
- Dual-Link True Wireless Stereo Audio.
Enhanced Gaming Experience
The MediaTek Dimensity 7350 is equipped with MediaTek HyperEngine 5.0, which includes several gaming-related optimizations to ensure that games run smoothly, efficiently, and with low battery consumption. This technology ensures a longer battery life even when connected to 5G and Wi-Fi, making it ideal for avid mobile gamers.
AI and Imaging Capabilities
The MediaTek NPU 657 enhances AI processing, making tasks such as image recognition and natural language processing faster and more efficient. The chipset also supports advanced camera features, thanks to the MediaTek Imagiq 765 ISP. This includes support for high-resolution cameras up to 200MP, 14-bit HDR imaging, and advanced video recording capabilities, ensuring stunning photography and videography.
Connectivity and Compatibility
The MediaTek Dimensity 7350 chipset offers extensive connectivity options, including support for the latest Wi-Fi 6E standard, Bluetooth 5.3, and comprehensive 5G capabilities. This ensures that devices powered by this chipset can enjoy fast and stable internet connections, whether on cellular networks or Wi-Fi.
Conclusion
In summary, the MediaTek Dimensity 7350 SoC is a powerful and efficient chipset designed for mid-range smartphones. With its advanced CPU and GPU architecture, robust AI capabilities, and comprehensive connectivity options, it promises to deliver a superior user experience, especially for gaming and multimedia applications. As smartphones featuring this chipset are expected to launch soon, consumers can look forward to affordable devices with high-end features.
