MediaTek has officially launched the MediaTek Dimensity 9400, a flagship chipset packed with cutting-edge technology that promises unparalleled performance and efficiency. The new SoC (System on Chip), built on TSMC’s 3nm (N3E) process, introduces advanced CPU architecture, a powerful GPU, on-device AI, and optimized power management, positioning itself as a leader in the mobile industry.
This article takes an in-depth look at the MediaTek Dimensity 9400, detailing its features, improvements, and specifications that set it apart from its predecessors. From its processing power to its gaming and AI capabilities, here’s everything you need to know about MediaTek’s latest breakthrough.
The Architecture: Power Meets Efficiency
The MediaTek Dimensity 9400 comes with a 1+3+4 CPU architecture, comprising:
- 1 Cortex-X925 super-performance core, clocked at a remarkable 3.63 GHz.
- 3 Cortex-X4 performance cores, each running at 3.3 GHz.
- 4 Cortex-A720 efficiency cores, clocked at 2.4 GHz.
This configuration offers an impressive balance between raw power and energy efficiency. MediaTek claims a 35% improvement in single-core performance and 28% in multi-core performance compared to its predecessor, the Dimensity 9300. The 15% increase in Instructions Per Cycle (IPC) and enhanced clock speeds result in a major leap in processing power.
Moreover, the chipset features a 100% increase in L2 cache and a 50% increase in L3 cache, improving overall performance while boosting power efficiency.
Immortalis-G925 GPU: Gaming Powerhouse
For gamers, the Immortalis-G925 GPU introduces significant upgrades:
- 41% peak performance boost, ensuring smoother gameplay.
- 40% faster ray tracing performance, bringing console-level realism to mobile devices.
- 44% power efficiency improvement, allowing for longer gaming sessions without compromising performance.
Ray tracing technology, which was previously limited to desktop-grade graphics, is now available in mobile devices. The Immortalis-G925 GPU offers enhanced visual details, realistic lighting, and shadow effects that make gaming more immersive than ever. The HyperEngine 3.0 technology further optimizes performance by ensuring a stable frame rate while reducing overheating and power consumption.
AI-Powered Innovation with NPU 890
Artificial intelligence (AI) is a key focus for the MediaTek Dimensity 9400. Powered by the NPU 890, this eighth-generation AI processor delivers:
- 35% less power consumption compared to previous models.
- 80% faster large language model (LLM) prompt processing.
- 50 tokens per second capacity for handling multimodal AI tasks.
One of the standout features is the Agentic AI Engine (DAE), a first in mobile chipsets. This technology enables on-device AI training for high-quality video generation and AI-driven content creation. The integration of on-device LoRA (Low-Rank Adaptation) training and Generative AI support gives developers powerful tools to create more advanced AI applications.
Advanced Imaging Capabilities: Imagiq 1090 ISP
The Dimensity 9400‘s imaging prowess is powered by the Imagiq 1090 Image Signal Processor (ISP). This new ISP is designed for:
- HDR video capture across the full zoom range, ensuring consistent video quality even when switching between lenses or zoom levels.
- 100x zoom with exceptional detail retention, thanks to AI-powered image enhancement.
- 4K @ 60 fps video recording with 14% lower power consumption compared to previous chipsets.
These features make the Dimensity 9400 a game-changer for mobile photography and videography, allowing users to capture professional-grade content directly from their smartphones.
Memory and Storage: First to Support 10.7 Gbps LPDDR5X RAM
The MediaTek Dimensity 9400 is the first mobile chipset to feature 10.7 Gbps LPDDR5X RAM, the fastest mobile memory standard available. This ensures that the CPU, GPU, and AI processing units are always supplied with data at lightning speeds, enhancing multitasking, app performance, and gaming experiences.
Additionally, the chipset supports UFS 4.0 with MCQ (Multi-Circular Queue) storage, further reducing latency and improving data transfer rates, making it ideal for users who demand high-speed performance for file transfers, downloads, and app launches.
Connectivity: 5G and Wi-Fi 7 Capabilities
MediaTek has integrated the most advanced connectivity options into the MediaTek Dimensity 9400, ensuring seamless online experiences:
- 3GPP Release-17 5G modem, supporting global bands and 4CC-CA for 7Gbps download speeds.
- Wi-Fi 7 with tri-band concurrency for up to 7.3 Gbps data rates.
- Bluetooth 5.4 with 50% more power efficiency compared to its predecessor.
Additionally, MediaTek Xtra Range 3.0 technology extends Wi-Fi signal coverage by 30 meters, ensuring stable connectivity even in large spaces.
Specifications Summary
| Component | Details |
|---|---|
| Process Technology | TSMC 3nm (N3E) |
| CPU Architecture | 1x Cortex-X925 @ 3.63 GHz, 3x Cortex-X4 @ 3.30 GHz, 4x Cortex-A720 @ 2.4 GHz |
| GPU | Immortalis-G925, 12 cores, 41% faster performance |
| Memory | LPDDR5X @ 10.7 Gbps |
| Storage | UFS 4.0 + MCQ |
| ISP | Imagiq 1090, 4K60 video capture, 100x AI zoom |
| AI Processing | NPU 890, Agentic AI Engine, 80% faster LLM prompts |
| 5G Connectivity | 4CC-CA, 7Gbps sub-6GHz download speeds |
| Wi-Fi | Wi-Fi 7 (tri-band), up to 7.3Gbps |
| Bluetooth | Bluetooth 5.4 |
| Max Camera Sensor | 320 MP |
| Video Encoding | 8K @ 60 fps, 10-bit video capture |
A Glimpse into the Future: Foldable and Tri-Fold Display Support
The Dimensity 9400 is designed with future technologies in mind. It supports tri-fold smartphones, offering manufacturers more flexibility to create foldable devices with larger displays. Additionally, the MiraVision 1090 ensures that visuals are optimized for various lighting conditions, with pixel-perfect precision and OLED panel burn-in protection.
Conclusion: Leading the Flagship Market
With the launch of the MediaTek Dimensity 9400, MediaTek has once again positioned itself as a leader in mobile innovation. Its powerful 1+3+4 CPU architecture, Immortalis-G925 GPU, and advanced AI capabilities make it a versatile and efficient chipset for flagship devices. Moreover, its support for future technologies like tri-fold displays and Agentic AI paves the way for the next generation of smartphones.
Expect the MediaTek Dimensity 9400 to power upcoming flagship models, including the Oppo Find X8 and vivo X200, set to launch by the end of 2024. Whether you’re a mobile gamer, photographer, or someone who values performance and efficiency, the Dimensity 9400 promises to deliver a superior experience.
