The MediaTek Dimensity 9500 is emerging as a highly anticipated contender in the flagship smartphone chipset market. With leaked specifications and cutting-edge technology, this SoC (System-on-Chip) promises significant upgrades in performance, efficiency, and capabilities. Here’s everything you need to know about the MediaTek Dimensity 9500.

Key Specifications at a Glance
Feature | Details |
---|---|
Fabrication Process | TSMC N3P (3nm) |
CPU Configuration | 2 Cortex-X930 cores @ 4GHz, 6 Cortex-A730 cores |
Architecture | New Travis & Gelas CPU architecture |
Clock Speed | Up to 4GHz |
GPU | Not specified yet |
Performance Enhancement | 20% better in multi-threaded workloads with SME |
Process Efficiency | Improved over N3E; second only to 2nm technologies |
Fabrication Process and Architecture
- TSMC N3P Technology
- The Dimensity 9500 will utilize TSMC’s advanced N3P process.
- This fabrication technology provides better performance and energy efficiency compared to the N3E process used in the Dimensity 9400.
- While not as efficient as 2nm processes, it stands out among current 3nm technologies.
- New CPU Architecture
- The chipset adopts a novel Travis and Gelas architecture.
- This includes a powerful 2+6 core configuration:
- Two Cortex-X930 prime cores operating at 4GHz.
- Six Cortex-A730 high-performance cores.
- The architecture ensures a significant leap from the Dimensity 9400’s 1+3+4 setup.
Performance Features
- Clock Speeds and Efficiency
- The Cortex-X930 cores provide peak speeds of up to 4GHz, ensuring faster processing.
- This is a noticeable improvement over the Dimensity 9400’s 3.63GHz peak.
- Multi-Threaded Performance
- ARM’s Scalable Matrix Extension (SME) boosts multi-threaded workload efficiency by 20%.
- This means better handling of tasks requiring extensive parallel processing, such as gaming and AI applications.
- Competitor Comparison
- The Dimensity 9500 may lag behind the Exynos 2600, which is rumored to leverage Samsung’s 2nm process.
- However, its 3nm N3P process offers a strong balance of cost and performance.

Why Not TSMC’s 2nm Process?
MediaTek’s decision to stick with the N3P process instead of moving to TSMC’s 2nm fabrication raises questions. Speculation suggests that Apple has reserved TSMC’s 2nm production capacity for its A19 Bionic chip, leaving MediaTek and other manufacturers with fewer options.
Dimensity 9500 vs Snapdragon 8 Elite Gen 2
- Core Configuration Similarities
- Like Qualcomm’s Snapdragon 8 Elite Gen 2, the Dimensity 9500 features a 2+6 core configuration.
- Clock Speed Differences
- The Snapdragon 8 Elite Gen 2 offers a slightly higher clock speed of 4.32GHz compared to the Dimensity 9500’s 4GHz.
- Technology Parity
- Both chipsets use TSMC’s N3P process, leveling the playing field in fabrication technology.
- SME Implementation
- Both the Dimensity 9500 and Snapdragon 8 Elite Gen 2 support SME, ensuring improved AI and workload efficiency.
Potential Impact on Smartphone Market
- Enhanced Benchmarks
- Early leaks suggest single-core Geekbench 6 scores of around 4,000, marking a 33% improvement over the Dimensity 9400.
- Competitive Edge
- The chipset could rival Qualcomm’s Snapdragon 8 Elite series and Exynos 2600, narrowing the gap between MediaTek and its competitors.
- Adoption by OEMs
- Improved performance may convince more smartphone manufacturers to integrate the Dimensity 9500 into their flagship devices.
Rumored Features in Detail
Feature | Description |
---|---|
SME Technology | Boosts multi-threaded workloads by up to 20%. Ideal for AI and gaming applications. |
Advanced Core Setup | Uses a 2+6 architecture for balanced performance and efficiency. |
Improved Power Efficiency | Offers better battery life due to the N3P process. |
Travis & Gelas Architecture | Incorporates unannounced ARM technologies for future-proofing. |
Launch Timeline
- The Dimensity 9500 is expected to launch in October 2025, coinciding with the release of Samsung’s Exynos 2600.
Conclusion: What to Expect
The MediaTek Dimensity 9500 is shaping up to be a game-changer in the smartphone industry. With cutting-edge technology, an improved architecture, and impressive performance features, it has the potential to challenge Qualcomm and Samsung’s dominance. While it may lack the efficiency of 2nm processes, its use of TSMC’s advanced 3nm N3P fabrication ensures a competitive edge.
As leaks continue to pour in, tech enthusiasts eagerly await more concrete details and benchmark results to see how this chipset performs against its rivals.